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Advanced Parametrical Modelling of 24 Ghz Radar Sensor Ic Packaging Components : Volume 9, Issue 28 (01/08/2011)

By Kazemzadeh, R.

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Book Id: WPLBN0003983322
Format Type: PDF Article :
File Size: Pages 7
Reproduction Date: 2015

Title: Advanced Parametrical Modelling of 24 Ghz Radar Sensor Ic Packaging Components : Volume 9, Issue 28 (01/08/2011)  
Author: Kazemzadeh, R.
Volume: Vol. 9, Issue 28
Language: English
Subject: Science, Advances, Radio
Collections: Periodicals: Journal and Magazine Collection, Copernicus GmbH
Historic
Publication Date:
2011
Publisher: Copernicus Gmbh, Göttingen, Germany
Member Page: Copernicus Publications

Citation

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Wellmann, J., John, W., Bala, U. B., Thiede, A., & Kazemzadeh, R. (2011). Advanced Parametrical Modelling of 24 Ghz Radar Sensor Ic Packaging Components : Volume 9, Issue 28 (01/08/2011). Retrieved from http://www.ebooklibrary.org/


Description
Description: University of Paderborn (HFE), Paderborn, Germany. This paper deals with the development of an advanced parametrical modelling concept for packaging components of a 24 GHz radar sensor IC used in automotive driver assistance systems. For fast and efficient design of packages for system-in-package modules (SiP), a simplified model for the description of parasitic electromagnetic effects within the package is desirable, as 3-D field computation becomes inefficient due to the high density of conductive elements of the various signal paths in the package. By using lumped element models for the characterization of the conductive components, a fast indication of the design's signal-quality can be gained, but so far does not offer enough flexibility to cover the whole range of geometric arrangements of signal paths in a contemporary package. This work pursues to meet the challenge of developing a flexible and fast package modelling concept by defining parametric lumped-element models for all basic signal path components, e.g. bond wires, vias, strip lines, bumps and balls.

Summary
Advanced parametrical modelling of 24 GHz radar sensor IC packaging components

Excerpt
Ahn, M.-H., Lee, D., and Kang, S.-Y.: Optimal Structure of Wafer Level Package for the Electrical Performance, IEEE Electronic Components and Technology Conference, 2000.; EMPIRE XCcel Manual: IMST GmbH – Kamp-Lintfort – Germany, 08/2009.; Hussein, H. M. and El-Badawy, E.: An Accurate Equivalent Circuit Model of Flip Chip and Via Interconnects, IEEE MTT-S Digest, 44(12), 2543–2553, 1996.; Ndip, I., Sommer, G., John, W., and Reichl, H.: A Novel Modelling Methodology of Bump Arrays for RF and High-Speed Applications, IMAPS 2003 – 36th International Symposium on Microelectronics; Boston, Massachusetts, USA, 992–997, 2003.; Pozar, D. M.: Microwave Engineering, John Wiley & Sons, 2nd edition, p 385, 1998.

 

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